3D Integration

Concepts and metallization processes for the integration of electronics and micro/nanosystem components: Development of integration schemes (3D-Integration) using Through Silicone Vias (TSV) considering the special requirements of micro/nanosystem components. TSV metallization using copper-CVD and ECD in order to achieve good step coverage and defective-free filling of TSVs with high aspect ratios (AR ≥ 4).